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® ETX®-PM
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Table of Contents
Table of Contents
1 User Information ........................................................................................................ 7
1.1 About This Manual .............................................................................................7
1.2 Copyright Notice ...............................................................................................7
1.3 Trademarks ......................................................................................................7
1.4 Standards ........................................................................................................7
1.5 Warranty .........................................................................................................7
1.6 Technical Support..............................................................................................8
2 Introduction .............................................................................................................. 9
2.1 ETX®-PM .........................................................................................................9
2.2 ETX® Documentation .........................................................................................9
2.3 ETX® Benefits ...................................................................................................9
3 Specifications ...........................................................................................................11
3.1 Functional Specifications .................................................................................. 11
3.1.1 Block diagram ................................................................................................ 13
3.2 Mechanical Specifications ................................................................................. 14
3.2.1 Dimensions .................................................................................................... 14
3.3 Electrical Specifications .................................................................................... 14
3.3.1 Supply Voltage................................................................................................ 14
3.3.2 Supply Voltage Ripple ...................................................................................... 14
3.3.3 Supply Current 5 V_SB ...................................................................................... 14
3.3.4 Supply Current (typical, DOS prompt) .................................................................. 14
3.3.5 Supply Current (Windows XP SP2) ....................................................................... 15
3.3.6 CMOS Battery Power Consumption & RTC Accuracy .................................................. 15
3.4 Environmental Specifications ............................................................................ 16
3.4.1 Temperature................................................................................................... 16
3.4.2 Humidity ....................................................................................................... 16
3.5 MTBF............................................................................................................. 17
6 Important Information...............................................................................................42
6.1 Max CPU Frequency setting ................................................................................ 42
6.2 Max CPU Frequency default settings .................................................................... 42
6.3 Limitations .................................................................................................... 42
6.3.1 ETX®-PM Celeron 1500 MHz/1300 MHz/1000 MHz/800 MHz/600 MHz ....................... 43
6.4 Cooling Solutions ............................................................................................ 44
7 Design Considerations................................................................................................45
7.1 Thermal Management ....................................................................................... 45
7.2 Heatspreader Dimensions ................................................................................. 46
7.2.1 ETX®-PM Heatspreader for modules up to CE 2.7.X ................................................. 46
7.2.2 ETX®-PM Heatspreader for modules starting from CE 3.X.X ...................................... 47
1 User Information
1.1 About This Manual
This document provides information about products from Kontron Embedded Modules GmbH and/or its
subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been
made to ensure that the information in this document is accurate, the information contained within is
supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.
1.3 Trademarks
The following lists the trademarks of components used in this board.
® IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business
Machines Corp.
® Microsoft is a registered trademark of Microsoft Corp.
® Intel is a registered trademark of Intel Corp.
® All other products and trademarks mentioned in this manual are trademarks of their
respective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
1.5 Warranty
This Kontron Embedded Modules GmbH product is warranted against defects in material and
workmanship for the warranty period from the date of shipment. During the warranty period, Kontron
Embedded Modules GmbH will at its discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are
observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling
by the buyer, unauthorized modification or misuse, operation outside of the product’s environmental
specifications or improper installation or maintenance.
Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products
not supplied by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded
Modules GmbH product.
2 Introduction
2.1 ETX®-PM
ETX®-PM component SBC modules support the Intel® Pentium® M Processor. The ETX®-PM features an
Intel® 855GME or Intel® 852GM chipset graphics memory controller hub with Intel® Extreme Graphics 2
technology.
In addition to standard ETX® features, the ETX®-PM supports four 2.0 USB ports, up to 1GB DDR-SDRAM
SO-DIMMS PC 1600/2100-memory modules, 10/100Base-T Ethernet, keyboard/mouse controllers, a
real-time clock, and a watchdog timer.
Peripheral PCI or ISA (ISA only available on ETX®-PM modules with Prev x12 or later) buses can be
implemented directly on the baseboard rather than on mechanically unwieldy expansion cards. The
ability to build a system on a single baseboard using the computer as one plug-in component simplifies
packaging, eliminates cabling, and significantly reduces system-level cost.
A single baseboard design can use a range of ETX® modules. This flexibility can differentiate products at
various price/performance points, or to design future proof systems that have a built-in upgrade path.
The modularity of an ETX® solution also ensures against obsolescence as computer technology evolves.
A properly designed ETX® baseboard can work with several successive generations of ETX® modules.
An ETX® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.
3 Specifications
3.1 Functional Specifications
BIOS
® Support for additional super I/O devices (COM3, COM4, LPT, and Floppy). Only
supported on Prev x12 or later
® BIOS: Phoenix, 1MB Flash-BIOS in Firmware Hub Flash Memory
Power Management
® APM 1.2 support
® ACPI 2.0 support
® Power on Suspend (S1) and Suspend to RAM (S3) support
Watchdog
3.2.1 Dimensions
® 95.0 mm x 114.0 mm (3.75” x 4.5”)
® Height approx. 12 mm (0.4”)
Note: It is difficult to test for all possible applications on the market. There may be an application that draws more
power from the CPU than the measured values in the table above. This should be taken into consideration if
you are on the board of the thermal specification. If this is the case improvements to your thermal solution
are recommended.
CMOS battery power consumption was measured with an ETX®-PM module on a standard Kontron ETX®
evaluation board. The system was turned off and the battery was removed from the evaluation board.
The 2.5 V or 3.0 V of power was supplied from a DC power supply. Do not use these values to calculate the
CMOS battery lifetime.
RTC deviation of ETX®-PM reflects state-of-the-art accuracy. In statistical test rows over a longer span of
time, different manufacturing sites and different product variants, it has been determined that an
average deviation of 1,5s/24h can be expected. Worst case deviation has been observed to 5s/24h.
3.4.1 Temperature
Note: *The maximum operating temperature with the heatspreader plate is the maximum measurable temperature
on any spot on the heatspreader’s surface. You must maintain the temperature according to the above
specification.
Note: **The maximum operating temperature is the maximum measurable temperature on any spot on a module’s
surface. You must maintain the temperature according to the above specification.
3.4.2 Humidity
® Operating: 10% to 90% (non condensing)
® Non operating: 5% to 95% (non condensing)
3.5 MTBF
The following MTBF (Mean Time Between Failure) values were calculated using a combination of
manufacturer’s test data, if the data was available, and a Bellcore calculation for the remaining parts.
The Bellcore calculation used is “Method 1 Case 1”. In that particular method the components are
assumed to be operating at a 50 % stress level in a 40° C ambient environment and the system is
assumed to have not been burned in. Manufacturer’s data has been used wherever possible. The
manufacturer’s data, when used, is specified at 50° C, so in that sense the following results are slightly
conservative. The MTBF values shown below are for a 40° C in an office or telecommunications
environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt
water exposure, etc.) lower MTBF values.
Notes: Fans usually shipped with Kontron Embedded Modules GmbH products have 50,000-hour typical operating
life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life
(as opposed to battery failures) is not accounted for in the above figures and need to be considered for
separately.Battery life depends on both temperature and operating conditions. When the Kontron unit has
external power; the only battery drain is from leakage paths.
4 ETX® Connectors
The pinouts for ETX® Interface Connectors X1, X2, X3, and X4 are documented for convenient reference.
Please see the ETX® Specification and ETX® Design Guide for detailed, design-level information.
IDE Ports
Ethernet
Power Good/Reset Input
ATX PS Control ISA Bus
X4 X2
Speaker
Battery
I2C-Bus
SM-Bus
Feature Connector X6
DVOB + DVOC
top view
(connectors only)
side view
(connectors only)
Notes: * To protect external power lines of peripheral devices, make sure that:
- the wires have the right diameter to withstand the maximum available current
- the enclosure of the peripheral device fulfils the fire-protection requirements of IEC/EN60950
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
PCI Bus
The implementation of this subsystem complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.
USB
Three USB host controllers (two 1.1 UHCI and one EHCI high-speed 2.0 controller) are on the Intel®
82801DB south bridge device. The USB controllers comply with both versions 1.1 and 2.0 of the USB
standard and are backward compatible. The three controllers implement a root hub, which have two USB
ports each.
Configuration
The USB controllers are PCI bus devices. The BIOS allocates required system resources during
configuration of the PCI bus.
Audio
The ETX®-PM PCI audio controller is integrated in the Intel® 82801DB southbridge. The audio codec is
compatible with AC97.
Configuration
The audio controller is a PCI bus device. The BIOS allocates required system resources during
configuration of the PCI device.
Serial IRQ
The serial IRQ pin offers a standardized interface to link interrupt request lines to a single wire.
Configuration
The serial IRQ machine is in “Quiet Mode”, the frame size is 21 frames and the start frame pulse width is
4 clocks.
For additional information, refer to the ETX® Design Guide, I2C application notes, and JIDA
specifications, all of which are available on the Kontron Embedded Systems Web site.
4.4 Connector X2 (ISA Bus only supported on Prev. x12 and later)
Pin Signal Pin Signal Pin Signal Pin Signal
1 GND 2 GND 51 VCC * 52 VCC *
3 SD14 4 SD15 53 SA6 54 IRQ5
5 SD13 6 MASTER# 55 SA7 56 IRQ6
7 SD12 8 DREQ7 57 SA8 58 IRQ7
9 SD11 10 DACK7# 59 SA9 60 SYSCLK
11 SD10 12 DREQ6 61 SA10 62 REFSH#
13 SD9 14 DACK6# 63 SA11 64 DREQ1
15 SD8 16 DREQ5 65 SA12 66 DACK1#
17 MEMW# 18 DACK5# 67 GND 68 GND
19 MEMR# 20 DREQ0 69 SA13 70 DREQ3
21 LA17 22 DACK0# 71 SA14 72 DACK3#
23 LA18 24 IRQ14 73 SA15 74 IOR#
25 LA19 26 IRQ15 75 SA16 76 IOW#
27 LA20 28 IRQ12 77 SA18 78 SA17
29 LA21 30 IRQ11 79 SA19 80 SMEMR#
31 LA22 32 IRQ10 81 IOCHRDY 82 AEN
33 LA23 34 IO16# 83 VCC * 84 VCC *
35 GND 36 GND 85 SD0 86 SMEMW#
37 SBHE# 38 M16# 87 SD2 88 SD1
39 SA0 40 OSC 89 SD3 90 NOWS#
41 SA1 42 BALE 91 DREQ2 92 SD4
43 SA2 44 TC 93 SD5 94 IRQ9**
45 SA3 46 DACK2# 95 SD6 96 SD7
47 SA4 48 IRQ3 97 IOCHK# 98 RSTDRV
49 SA5 50 IRQ4 99 GND 100 GND
Notes: *To protect external power lines of peripheral devices, make sure that:
- the wires have the right diameter to withstand the maximum available current.
- the enclosure of the peripheral device fulfils the fire-protection requirements of IEC/EN60950
** IRQ9 is used for SCI in ACPI mode. Do not use for legacy ISA devices.
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
4.5 Connector X3 (VGA, LCD, Video, COM1 and COM2, LPT/Floppy, Mouse,
Keyboard)
Flat-Panel Interfaces
ETX®-PM modules can implement an LVDS flat-panel interface called JUMPtec Intelligent LVDS Interface
(JILI). These modules do not implement a parallel digital flat-panel interface called JUMPtec Intelligent
Digital Interface (JIDI).
LVDS Interface Pinout (JILI)
Pin Signal Pin Signal
1 GND 2 GND
3 R 4 B
5 HSY 6 G
7 VSY 8 DDCK
9 DETECT#** 10 DDDA
11 LCDDO16 12 LCDDO18
13 LCDDO17 14 LCDDO19
15 GND 16 GND
17 LCDDO13 18 LCDDO15
19 LCDDO12 20 LCDDO14
21 GND 22 GND
23 LCDDO8 24 LCDDO11
25 LCDDO9 26 LCDDO10
27 GND 28 GND
29 LCDDO4 30 LCDDO7
31 LCDDO5 32 LCDDO6
33 GND 34 GND
35 LCDDO1 36 LCDDO3
37 LCDDO0 38 LCDDO2
39 VCC * 40 VCC *
41 JILI_DAT 42 LTGIO0**
43 JILI_CLK 44 BLON#
45 BIASON** 46 DIGON
47 COMP** 48 Y**
49 SYNC** 50 C**
Notes: *To protect external power lines of peripheral devices, make sure that:
- the wires have the right diameter to withstand the maximum available current
- the enclosure of the peripheral device fulfils the fire-protection requirements of IEC/EN60950.
**This signal is not supported on the ETX®-PM.
Notes: *To protect external power lines of peripheral devices, make sure that:
- the wires have the right diameter to withstand the maximum available current
- the enclosure of the peripheral device fulfils the fire-protection requirements of IEC/EN60950
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
Note:
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
Note: Connector X3 Signal Description
VGA Output
PS/2 Keyboard
The implementation of the keyboard interface complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.
Configuration:
The keyboard uses I/O and IRQ resources. The BIOS allocates the resources during POST configuration.
The resources are set to be compatible with common PC/AT settings. Use the BIOS setup to change some
keyboard-related parameters.
PS/2 Mouse
The implementation of the mouse interface complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.
Configuration:
The mouse uses I/O and IRQ resources. The BIOS allocates the resources during POST configuration. The
resources are set to be compatible with common PC/AT settings. You can change some mouse-related
parameters from the BIOS setup.
IrDA
The ETX®-PM is capable of IrDA SIR operation. This feature is implemented in the Winbond 83627HF.
Contact Kontron Embedded Systems for help with this feature.
Parallel Port
The parallel-communication interface shares signals with the floppy-disk interface. The implementation
of this parallel port complies with the ETX® Specification. Implementation information is provided in the
ETX® Design Guide. Refer to the documentation for additional information.
Configuration:
The parallel-communication interface uses I/O, IRQ, and DMA resources. The resources are allocated by
the BIOS during POST configuration and are set to be compatible with common PC/AT settings. You can
change some parameters of the parallel-communication interface through the BIOS setup.
Floppy
The floppy-disk interface shares signals with the parallel-communication interface. The floppy interface
is limited to one drive (drive_1). A standard floppy cable has two connectors for floppy drives. One
connector has a non-twisted cable leading to it, the other has a twisted cable leading to it. When using
the floppy interface you must connect the floppy drive to the connector (drive_1) that has the non-
twisted cable leading to it.
The implementation of this subsystem complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.
Configuration:
The floppy-disk controller uses I/O, IRQ, and direct memory access (DMA) resources. These resources are
allocated by BIOS during POST configuration and are compatible with common PC/AT settings. You can
change some parameters of the parallel-communication interface through the BIOS setup.
Notes: *To protect external power lines of peripheral devices, make sure that:
- the wires have the right diameter to withstand the maximum available current
- the enclosure of the peripheral device fulfils the fire-protection requirements of IEC/EN60950
**This signal is not supported on the ETX®-PM.
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
Note: The termination resistors in this table are already mounted on the ETX® board. Please refer to the design
guide for information about additional termination resistors.
Note: Connector X4 Signal Description
IDE Ports
The IDE host adapter is capable of DMA-100*/66*/33 operation. The implementation of this subsystem
complies with the ETX® Specification. Implementation information is provided in the ETX® Design
Guide. Refer to those documents for additional information.
Note: *For UDMA-100/66 operation please follow the System Guidelines for ULTRA DMA of the ATA-Specification.
The ETX®-concept in combination with peripheral devices (cable, connectors, base board layout…) can
worse the transmission quality so that it is necessarily to decrease the UDMA-Mode to values below 3.
Configuration:
Primary and secondary IDE host adapters are PCI bus devices. They are configured by the BIOS during PCI
device configuration. You can disable them in setup. Resources used by the primary and secondary IDE
host adapters are compatible with the PC/AT.
Note: PHOENIX BIOS will not recognize a Slave device on an IDE port if there is no Master device connected to the
same IDE port. Implementation and limitation information is provided in the ETX® Design Guide from
document revision 2.1. Refer to the documentation for additional information.
Ethernet
The Ethernet interface is based on the Intel® 82562 Fast Ethernet PCI controller. This 32-bit PCI
controller is a fully integrated 10/100BASE-TX LAN solution.
The Ethernet interface requires an external transformer. See the ETX® Design Guide for suggestions on
transformer selection.
Configuration:
The Ethernet interface is a PCI device. The BIOS setup automatically configures it during configuration of
the PCI device.
Note: Implementation and limitation information is provided in the ETX® Design Guide from document revision
2.1. Refer to the documentation for additional information.
Power Control
Power Good / Reset Input:
The ETX®-PM provides an external input for a power-good signal or a manual- reset pushbutton. The
implementation of this subsystem complies with the ETX® Specification. Implementation information is
provided in the ETX® Design Guide. Refer to the documentation for additional information.
Power Management
ATX PS Control:
The ETX®-PM can control the main power output of an ATX-style power supply. The implementation of
this subsystem complies with the ETX® Specification. Implementation information is provided in the
ETX® Design Guide. Refer to the documentation for additional information.
Miscellaneous Circuits
Speaker
The implementation of the speaker output complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.
Battery
The implementation of the battery input complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.
In compliance with EN60950, there are at least two current-limiting devices (resistor and diode)
between the battery and the consuming component.
I2C Bus
The I2C Bus is implemented by using general purpose I/O.
You also can access the I2C Bus via JUMPtec’s Intelligent Device Architecture (JIDA) BIOS functions.
For additional information, refer to the ETX® Design Guide. I2C application notes and JIDA
specifications which are available at the Kontron Web site.
SM Bus
System Management (SM) bus signals are connected to the SM bus controller, which is located in the
southbridge (Intel 82801DB) device. For more information about the SM bus, please see the System
Management (SM) Bus section in the Appendix A: System Resources chapter.
The ETX®-PM Digital Video Out port is integrated in the Intel® 852GM/855GME northbridge. It has
the following features:
® 2 Digital Video Out Ports (DVOB & DVOC) on 855GME chipset
® 1 digital Video Out Port (DVOC) on 852GM chipset
® Two 12-bit channels
® The DVO B/C ports can drive a variety of DVO devices (TV-Out Encoders, TMDS and
LVDS transmitters, etc.)
The Feature Connector can be used with the ETX®-Feature Connector Adaptor ADA-ETX® FC and is
available on ETX®-PM Boards since CE-Rev. x15. The adaptor board ADA-ETX® FC converts the signals
from DVO to DVI and is available optional.
Connector
® Molex - 54132-5097 (RoHS)
® 0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact
Style, 50 Circuits
To activate an attached ADA-ETX® FC3 please enable in the Phoenix Bios Setup:
Advanced -> Display Control : EFP Only or CRT+EFP
5 Special Features
5.1 Watchdog Timer
This feature is implemented in the Winbond 83627HF super I/O. You can configure the Watchdog Timer
(WDT) in BIOS setup to start after a set amount of time after power-on boot. The WDT can also be
controlled by the JIDA32 Library API (Refer to Appendix F: JIDA Standard). The application software
should strobe the WDT to prevent its timeout. Upon timeout, the WDT resets and restarts the system. This
provides a way to recover from program crashes or lockups.
Configuration
You can program the timeout period for the watchdog timer in two ranges:
® 1-second increments from 1 to 255 seconds
® 1-minute increments from 1 to 255 minutes
Contact Kontron Embedded Modules technical support for information on programming and operating
the WDT.
6 Important Information
Kontron Embedded Modules GmbH currently offers different variants of the ETX®-PM. They are the
1100MHz, 1400MHz, 1600MHz, 1800MHz and Celeron 600MHz, 1000MHz and 1300MHz versions. These
variants utilize a smart BIOS that is capable of identifying the CPU that the module is equipped with.
Another feature of the BIOS is its ability to offer the user the option to set the maximum CPU frequency
when using modules equipped with the 1100MHz, 1400MHz, 1600MHz, or 1800MHz. The Celerons
600MHz, 1000MHz or 1300MHz does not support this option.
Note: The Max CPU Frequency setting option is only available on modules that use BIOS version MODBR114.wph or
higher.
Note: The ETX®-PM Celeron 1300MHz does not support the Max CPU frequency setting option.
The Max CPU Frequency setting option is only available on modules that use BIOS version MODBR114.wph or
higher.
6.3 Limitations
With the introduction of higher frequency CPUs new problems arise when considering cooling solutions.
Although these higher frequency CPUs offer greater performance they also produce more heat, which
must be efficiently dissipated from the application.
As mentioned in the previous section each ETX®-PM module that supports the Max CPU Frequency
setting option has a predefined default frequency setting. This is done to ensure that the module can
operate using the standard ETX®-PM heatspreader without reaching the “Critical Trip Point” when used
at room temperature (typical 24°C).
The “Critical Trip Point” is designed to ensure that the module is shut down before any thermal damage
can occur to the CPU. This feature is available on all ETX®-PM modules. If the cooling solution is unable
to maintain a temperature below the “Critical Trip Point” then the module is automatically shut down.
The “Critical Trip Point” feature only works in conjunction with an ATX power supply or power supplies
that utilize the PS_ON signal.
Warning: AT power supplies do not support the “Critical Trip Point” feature.
The ETX®-PM 1600MHz and 1800MHz can also generate extreme heat when operated at their respective
maximum CPU frequencies. Due to this reason Kontron Embedded Modules GmbH has decided to offer
the option for setting “Max CPU Frequency” within the BIOS setup. In order to ensure that both of these
modules operate with the standard ETX®-PM heatspreader Kontron Embedded Modules GmbH has had to
limit the CPU output to a predefined default frequency. The following defaults have been defined.
ETX®-PM 1600MHz 1800MHz
Default 1200MHz 1400MHz
Although these defaults have been defined the user still has the ability to increase the CPU frequency
using the “Max Frequency Setting”. If the user chooses to use the maximum CPU frequency offered by
the module they must ensure that they also use a cooling solution that is capable of dissipating the heat
so that the “Critical Trip Point” is not reached. As mentioned earlier if this safety mechanism is triggered
the module will automatically shut down.
Warning: Selecting frequencies higher then the default may cause the system to reach “Critical Trip
Point” and shutdown if a proper cooling solution is not used. Always ensure that you use a
proper cooling when selecting higher frequency settings.
MHz/1000 MHz/800 MHz/600 MHz does not support TM2. See sections Thermal Monitor and
Catastrophic Thermal Protection and Power Menu of this document for more information about TM1 and
TM2.
Warning: AT power supplies do not support the “Critical Trip Point” feature.
7 Design Considerations
7.1 Thermal Management
A heat-spreader plate assembly is available from Kontron Embedded Modules GmbH for the ETX®-PM.
The heat-spreader plate on top of this assembly is NOT a heat sink. It works as an ETX®-standard thermal
interface to use with a heat sink or other cooling device.
External cooling must be provided to maintain the heat-spreader plate at proper operating
temperatures. Under worst-case conditions, the cooling mechanism must maintain an ambient air and
heat-spreader plate temperature of 60° C or less.
The aluminum slugs and thermal pads on the underside of the heat-spreader assembly implement
thermal interfaces between the heat spreader plate and the major heat-generating components on the
ETX®-PM. About 80 percent of the power dissipated within the module is conducted to the heat-spreader
plate and can be removed by the cooling solution.
For 1100MHz modules, the heat dissipated into the plate ranges from 18 to 20 watts. Design a cooling
solution to dissipate the heat load on a heat-spreader plate at a minimum of 20 watts to accommodate
all ETX®-PM modules.
You can use many thermal-management solutions with the heat-spreader plates, including active and
passive approaches. The optimum cooling solution varies, depending on the ETX® application and
environmental conditions. Please see the ETX® Design Guide for further information on thermal
management.
Article numbers:
18008-0000-99-2: Heatspreader ETX®-PM, Threaded Hole Stand Off for boards up to CE 2.7.X
18008-0000-99-3: Heatspreader ETX®-PM, Through Hole Stand Off for boards up to CE 2.7.X
Article numbers:
18008-0000-99-4: Heatspreader ETX®-PM, Threaded Hole Stand Off for boards from CE 3.X.X
18008-0000-99-5: Heatspreader ETX®-PM, Through Hole Stand Off for boards from CE 3.X.X
The APIC is not supported by all operating systems. Only Windows Xp supports APIC. The APIC mode must
be enabled in the BIOS setup before the OS installation. APIC only works in ACPI mode.
For more information see chapter 8 of the IA-32 Intel Architecture Software Developer’s Manual, Volume
3.
Note: For more information see: BIOS Settings for Native-Mode-Capable ATA Controllers
Note: TM2 is the recommended mode for the Intel Pentium M processor.
Not supported on the ETX®-PM Celeron 0.6 GHz, 0.8 GHz, 1.0 GHz, 1.3GHz and 1.5 GHz.
Thermal Monitor supports two modes to activate the TCC: Automatic and On-Demand mode. The Intel
Thermal Monitor Automatic Mode must be enabled via BIOS for the processor to be operating within
specification.
Automatic mode does not require any additional hardware, software drivers, or interrupt handling
routines.
Note: With a properly designed thermal solution, the TCC is only active for very short periods, hence processor
performance impact is expected to be so minor that it would not be detectable.
For more details see chapter 5.1.2 of the Intel Pentium M Processor Datasheet.
The Intel Pentium M processor supports the THERMTRIP# signal for catastrophic thermal protection.
In the event of a catastrophic cooling failure, the processor will automatically shut down when the
silicon has reached a temperature of approximately 125°C. At this point the system BUS signal
THERMTRIP# will go active.
THERMTRIP# activation is independent of processor activity and does not generate any bus cycles.
8.3.1 Summary
Thermal Control Circuit reduces performance when the processor reaches its max. operating temperature
(100°C). THERMTRIP# shuts down the system in case of catastrophic cooling failure.
Note: Windows always runs at the highest performance state when the “Home/Office” or “Always On” power
scheme is selected.
For a more detailed information about processor performance control, see:
Chapter 8 of the ACPI Specification Revision 2.0c available at www.acpi.info Windows platform design note
and at: Windows Native Processor Performance Control
Active Cooling
The OS is turning the fan on/off. Active cooling devices typically consume power and produce noise, but
are able to cool a thermal zone without limiting system performance. The active cooling trip point
declares the temperature threshold the OS uses to decide when to start/stop active cooling devices. See
section ETX®-PM onboard Fan connector for more information about the ETX®-PM onboard Fan control.
Passive Cooling
The OS reduces the power consumption of the processor by throttling the processor clock to reduce the
temperature of the thermal zone. Passive cooling devices (processor) produce no noise. The passive
cooling trip point declares the temperature threshold where the OS will start or stop passive cooling.
Note: The ETX® PM BIOS supports only turning the onboard FAN ON/OFF. For additional support 3rd party software
is necessary. Schematics of Fan control
Pinout
1 2 3
Vcc = 5V
Imax (continuous) = 0,68 A
Imax (pulsed) = 2A
Sense (Tacho-pulse) = 4 Pulses per turn
Note: The 5 V output is not short circuit proof. The user has to ensure that the circuit is protected externally, for
example by a fuse on the backplane.
ΔP is the performance delta, Tt is the target temperature = passive cooling trip point. The two
coefficients TC1 and TC2 and the sampling period TSP are hardware dependent constants the end user
must supply (setup options section ACPI Control Submenu).
It’s up to the end user to set the cooling preference of the system by setting the appropriate trip points
in the BIOS setup.
Note: See chapter 12 of the ACPI specification (www.acpi.info) for more details.
9 System Resources
9.1 Interrupt Request (IRQ) Lines
Note: 1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.
2 Unavailable if baseboard is equipped with an I/O controller SMC FDC37C669, and the device is enabled in
setup.
3 Unavailable in Advanced Configuration and Power Interface (ACPI) mode. Used as System Control Interrupt
(SCI) in ACPI mode. Currently not free in Non-ACPI mode.
In APIC mode:
IRQ # Used For Available Comment
0 Timer0 No
1 Keyboard No
2 Slave 8259 No
3 COM2 No Note (1)
4 COM1 No Note (1)
5 PCI/LPT2 Yes Note (2)
6 Floppy Drive Controller No Note (1)
7 LPT1 No Note (1)
8 RTC No
9 SCI No System Control Interrupt (3)
10 COM3 Yes Note (2)
11 COM4 Yes Note (2)
12 PS/2 Mouse No Note (1)
13 FPU No
14 IDE0 No Note (4)
15 IDE1 No Note (4)
16 PIRQ[A] For PCI PCI IRQ line 1 + USB UCHI controller #1 + Graphics controller
17 PIRQ[B] For PCI PCI IRQ line 2 + AC97 Audio controller
18 PIRQ[C] For PCI PCI IRQ line 3 + USB UCHI controller #3 + Native IDE
19 PIRQ[D] For PCI PCI IRQ line 4 + USB UCHI controller #2
20 PIRQ[E] No Lan Controller
21 PIRQ[F] No
22 PIRQ[G] No
23 PIRQ[H] No USB EHCI controller
Note: 1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.
2 Unavailable if baseboard is equipped with an I/O controller SMC FDC37C669, and the device is enabled in
setup.
3 Unavailable in Advanced Configuration and Power Interface (ACPI) mode. Used as System Control
Interrupt (SCI) in ACPI mode. Currently not free in Non-ACPI mode.
4 IRQs are available if IDE controller is either disabled in setup or if in Native IDE mode.
The standard ETX®-PM Power management BIOS does support MARS (Mobile Application platform for
Rechargeable Systems). Further details about MARS are available at Embedded Modules Division -
Kontron.
10 BIOS Operation
The module is equipped with a Phoenix BIOS, which is located in an onboard Flash EEPROM. The device
has 8-bit access. Faster access (16 bit) is provided by the shadow RAM feature. You can update the BIOS
using a Flash utility.
Note: Selecting incorrect values may cause system boot failure. Load setup default values to recover by pressing
<F9>. It might also be necessary to use the “reset configuration data” option in the BIOS setup and set it to
“yes”. In certain circumstances this may also help to recover from system boot failure or a resource conflict.
Menu Bar
The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a
selection.
Legend Bar
Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The
table below describes the legend keys and their alternates.
Key Function
<F1> or <Alt-H> General Help window.
<Esc> Exit menu.
← or → Arrow key Select a menu.
↑ or ↓ Arrow key Select fields in current menu.
<Tab> or <Shift-Tab> Cycle cursor up and down.
<Home> or <End> Move cursor to top or bottom of current window.
<PgUp> or <PgDn> Move cursor to next or previous page.
<F5> or <-> Select previous value for the current field.
<F6> or <+> or <Space> Select next value for the current field.
<F9> Load the default configuration values for this menu.
<F10> Save and exit.
<Enter> Execute command or select submenu.
<Alt-R> Refresh screen.
Selecting an Item
Use the ↑ or ↓ key to move the cursor to the field you want. Then use the + and – keys to select a value
for that field. The Save Value commands in the Exit menu save the values displayed in all the menus.
Displaying Submenus
Use the ← or → key to move the cursor to the submenu you want. Then press <Enter>. A pointer ()
marks all submenus.
Note: All items on this menu cannot be modified in user mode. If any items require changes, please consult your
system Supervisor.
Mode 2
Mode 3
Mode 4
Mode 5
SMART Device Disabled
Shows if SMART Device monitoring is supported by the drive.
Monitoring Enabled
Note: Setting items on this menu to incorrect values may cause your system to malfunction.
*Setting this option to “yes”, under certain circumstances, may help to recover from system boot failure or a
resource conflict.
*Base I/O address 378h, 278h, 3BC Select I/O base of port.
*IRQ IRQ 5, IRQ 7 Select IRQ of parallel port.
*DMA channel DMA3, DMA1
Configure using these options:
Disabled
**External FDC [Disabled]: No configuration
Enabled
[Enabled]: User configuration
Disabled turns off the port.
**Serial port C Disabled
**Enabled requires end user to enter the base I/O
**Serial port D Enabled
address and the IRQ.
**Disabled turns off the port.
Disabled
**External LPT Enabled requires end user to enter the base I/O address
Enabled
and the IRQ.
Output only
**Mode Bi-directional Set the mode for the parallel port.
EPP
**Base I/O address 378h, 278h, Select I/O base of port.
**IRQ IRQ 5, IRQ 7 Select IRQ of parallel port.
This submenu shows the current voltages and temperatures of the system.
Vcc (3.3) 3.3V power plane
5Vsb 5V Stand by voltage
CPU core Core voltage (depends on CPU)
Battery Voltage Backup Battery Voltage
CPU Temperature Temperature of CPU die
CPU Fan Speed Speed of CPU Fan
Edges Per Fan
This is used to correctly display the Fan speed. Please note it only takes effect after a reboot.
Revolution
Notes: *Only available if Flat Panel Type (Enter PAID) or (Enter FPID) are selected.
**Only available if the DAC (MAX5362) is on the OEM backplane or the panel adapter.
***Only available if the digitally controlled potentiometer (Xicor X9429) is on the OEM backplane or the
panel adapter.
A power management system reduces the amount of energy used after specified periods of inactivity. The
setup menu supports:
® Full On state
Off, 5min, 10min, 15min, Inactivity period required after Standby to Suspend mode
Auto Suspend Timeout
20min, 30min, 40min, 60min (maximum power shutdown).
Inactivity period of hard disk required before standby (motor
Hard Disk Timeout Disabled, 10 sec – 15 min
off).
Wake up Events sub menu Allows editing of advanced power management features.
Off Enabled wakes the system on incoming calls detected by
Resume on Modem Ring
On modem (RI).
Off
Resume on Time Enabled wakes the system at a specific time.
On
Specify the time when the system is to wake up. <Tab>,
Resume Time 00:00:00
<Shift-Tab> or <Enter> selects field.
ATX
Power Supply Choose the connected power supply, ATX or AT.
AT
Power Off Determines if the system enters suspend or soft off when the
Power Button Function
Sleep power button is pressed.
Stay Off
Determines how the system behaves after a power failure.
Power Loss Control Power On
This only works in conjunction with a CMOS backup battery.
Last State
10.8.1 MultiBoot
Multiboot allows you to select the following boot devices:
® Hard disk
® Floppy disk
® CD-ROM
® Network card
You can make the selections from Setup, or by selecting the boot device in the BootFirst Menu.
Note: ETX® PM also supports booting from USB floppy and Mass Storage Device (MSD).
Notes: The standard 1.44MB floppy drive is referenced as Legacy Floppy Drives.
The BIOS only tries to boot from the devices (max 8) in the Boot Priority Order list.
The following sections describe the five options in Exit Menu. Pressing <Esc> does not exit this menu.
You must select an item from the menu to exit.
Discard Changes
Discards changes made during a Setup session and revert to values previously saved in CMOS.
Save Changes
Saves all selections without exiting Setup.
Note: Crisis Recovery requires either a floppy disk connected to the LPT interface (external floppy drive_1) or an
USB floppy drive.
® To create a Crisis Recovery Diskette, insert a blank diskette into Drive A: or B: and
execute WINCRISIS.EXE. This copies four files onto the Crisis Recovery Diskette.
File Purpose
MINIDOS.SYS Allows the system to boot in Crisis Recovery Mode.
PHLASH16.EXE Programs the Flash ROM.
BIOS.WPH Serves as the BIOS image to be programmed into Flash ROM.
® Connect a floppy drive with crisis disk to onboard floppy and the crisis recovery
dongle to COM1. Power on System to recover BIOS.
For more details about Crisis Recovery refer to Kontron Application Note 'KEMAP045' 'Phoenix BIOS
Update'
Note: Association between board and board number may change because of configuration changes. Do not rely on
any association between board and board number. Always use the procedure described above to determine
the association between board and board number.
Refer to the JIDA manual in the jidai1xx.zip folder, which is available from the Kontron Embedded
Modules GmbH Web site, for further information on implementing and using JIDA calls with C sample
code.
12.1 Buses
12.1.2 PCI/104
® Embedded PC 104 Consortium
® The consortium provides information about PC/104 and PC/104-Plus technology. You
can search for information about the consortium on the Web.
® PCI SIG
® The PCI-SIG provides a forum for its ~900 member companies, who develop PCI
products based on the specifications that are created by the PCI-SIG. You can search
for information about the SIG on the Web.
® PCI & PCI-X Hardware and Software Architecture & Design, Fifth Edition, Edward
Solari and George Willse, Annabooks, 2001, ISBN 0-929392-63-9.
® PCI System Architecture, Tom Shanley and Don Anderson, Addison-Wesley, 2000,
ISBN 0-201-30974-2.
12.3 Ports
12.3.3 USB
® USB Specification.
® USB Implementers Forum, Inc. is a non-profit corporation founded by the group of
companies that developed the Universal Serial Bus specification. The USB-IF was
formed to provide a support organization and forum for the advancement and
adoption of Universal Serial Bus technology. You can search for information about
the standard on the Web.
12.4 Programming
® C Programmer’s Guide to Serial Communications, Second Edition, Joe Campbell,
SAMS, 1987, ISBN 0-672-22584-0
® Programmer’s Guide to the EGA, VGA, and Super VGA Cards, Third Edition, Richard
Ferraro, Addison-Wesley, 1990, ISBN 0-201-57025-4
® The Programmer’s PC Sourcebook, Second Edition, Thom Hogan, Microsoft Press,
1991, ISBN 1-55615-321-X
® Undocumented PC, A Programmer’s Guide to I/O, CPUs, and Fixed Memory Areas,
Frank van Gilluwe, Second Edition, Addison-Wesley, 1997, ISBN 0-201-47950-8