Used ACCRETECH / TSK ML 300 #9248303 for sale

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ID: 9248303
Wafer Size: 12"
Vintage: 2008
Laser dicing saw, 12" Laser head: 60,000 Running hours Laser wavelength: 1064 Stealth dicing for wafer 2008 vintage.
ACCRETECH / TSK ML 300 is an innovative and precise scribing/dicing equipment for cutting and dividing materials. It is designed to provide the highest accuracy and productivity available in the industry. The machine provides a precision spindle with speeds up to 12,000 RPM, a dual linear guide bearing system, and superior Z-axis ballscrew drive, providing a cutting path of 0.1 µm. The unit also features a high-speed traveling mechanism and automated servo feed drive machine for accurate positioning and cutting throughout the process. For material cutting, the tool utilizes a high-power, high-efficiency spindle motor, that provides up to 30 kW of power in Short-Time-Overload (STO) mode, allowing for precise cutting operations in the most difficult of materials. The asset comes with a range of sizes and configurations of scribed blades, from 10 to 999 µm in diameter, allowing for precise cutting of the material in any form or shape for a broad range of applications. Additionally, the model features a range of trepan knives that can produce holes in the material of any size, with a maximum depth of 8 mm. The equipment features a fully automatic operation, allowing for unattended scribing operations, with a variety of programming methods, from handwheel control, to graphical user interface (GUI) programming from a PC, and the ability to store up to 500 program recipes. Additionally, an optional vision system can be added to the unit to check cut shapes and sizes, as well as cut accuracy, ensuring the highest quality in the finished parts. The overall design of TSK ML 300 has been optimized to provide the highest degree of accuracy, while at the same time being highly durable and easy to use. From its high quality materials to its advanced design and precise parts, the machine can offer a reliable and cost effective solution for cutting, dicing and scribing of a wide range of materials, with superior accuracy and productivity.
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